Jingfei Semiconductor Achieves Laser Lift-Off of 12-Inch Silicon Carbide Wafers
Jingfei Semiconductor has achieved lift-off of 12-inch silicon carbide wafers using its self-developed laser lift-off equipment. The technology has previously been validated by multiple customers in the 6-inch and 8-inch silicon carbide segments. Compared with mainstream 6-inch wafers, 12-inch wafers offer about four times the usable area and reduce per-chip costs by 30% to 40%. This breakthrough breaks the technological monopoly held by overseas manufacturers in large-size silicon carbide processing equipment and provides equipment support for expanding silicon carbide capacity.