27th CIOE Opens with More Than 4,000 Exhibitors

On September 9, 2026, the 27th China International Optoelectronic Exposition (CIOE) opened in grand style in Shenzhen. The show drew record interest, bringing together more than 4,000 leading optoelectronics companies from around the world. Eight themed exhibitions focused on information and communications, precision optics, camera technology and applications, laser and intelligent manufacturing, infrared & UV, smart sensing, new displays, AR & VR, and optoelectronic innovation, creating a high-quality industry platform spanning the entire optoelectronics value chain and integrating technical exchange, product display, and business matchmaking.

As AI large-model training and inference and agentic applications accelerate, demand for computing power and bandwidth continues to surge, opening up entirely new growth space for the optoelectronics industry. Innovative technologies are emerging rapidly across high-speed optical interconnects, AI sensing and imaging, and AI-enabled manufacturing. The opening day drew huge crowds in an unprecedented scene, with companies unveiling a flood of new products and cutting-edge technologies. On-site negotiations were brisk, supply-demand matchmaking efficient, and technical discussions lively. Industry leaders and innovative tech companies debuted their flagship annual products and breakthrough technical solutions, fully unleashing the innovation vitality of the optoelectronics industry. Industry experts and value-chain company representatives from around the world gathered in Shenzhen to explore frontier technologies, assess industry trends, and connect with quality resources, vividly demonstrating the strong momentum of accelerating innovation and coordinated growth in optoelectronics.

The opening ceremony brought together hundreds of guests, including Cao Jianlin, former Vice Minister of Science and Technology and Chairman and Director of Jihua Laboratory; Ye Tianchun, Chief Technologist of the National 02 Special Project and researcher at the Institute of Microelectronics, Chinese Academy of Sciences; Fan Dianyuan, academician of the Chinese Academy of Engineering; Zhang Xuejun, academician of the Chinese Academy of Engineering; Jia Ping, academician of the Chinese Academy of Sciences; Fan Zhongwei, academician of the Chinese Academy of Engineering; Sun Hongbo, academician of the Chinese Academy of Sciences; Yang Yang, Director of the New Technology Development Center of the China Association for Science and Technology; Peng Lihui, Executive Vice President of the China Electronics Chamber of Commerce; Liu Xu, Secretary-General of the Chinese Optical Society; Shen Ping, 37th Global President of the IEEE Photonics Society; and Yang Xiancheng, founder and Executive Chairman of CIOE, along with representatives of research institutes, universities, and key laboratories in optoelectronics, industry entrepreneurs, and industry media, who together witnessed the opening of the event.

Three co-located shows drive industry convergence, spanning the full optoelectronics, semiconductor, and electronics value chains

This year's CIOE was held concurrently with the IICIE International Integrated Circuit Innovation Expo and elexcon Shenzhen International Electronics Show & Embedded Systems Expo, forming a "three-show" co-location that together created a mega industry event of 320,000 square meters, promoting deep integration and mutual empowerment across the optoelectronics, semiconductor, and electronics industries.

On one hand, advanced semiconductor processes provide solid support for the scaled development of the optoelectronics industry: mature CMOS wafer lines enable volume production of silicon photonics, advanced packaging supports the deployment of CPO, NPO, heterogeneous integration, and HBM, and compound semiconductor processes underpin the R&D and manufacturing of optical chips, continuously driving the commercialization of next-generation optoelectronic technologies. On the other hand, optoelectronic technology effectively addresses bottlenecks in semiconductor industry development: high-speed optical interconnects support data transmission in ultra-large computing clusters, while high-precision optical lenses and inspection equipment enable chip manufacturing and precision metrology. Meanwhile, value-chain collaboration continues to deepen — optoelectronic devices handle sensing and transmission, IC chips provide computing power and storage, and electronic components and embedded systems support integration and control. End products such as automotive LiDAR, machine vision, and infrared imaging exemplify the coordinated drive of optoelectronics, semiconductors, and electronics.

A complete optoelectronics, semiconductor and electronics industry chain has taken shape, spanning upstream materials and chips, midstream devices and modules, and downstream systems and applications. The three co-located shows efficiently serve four core sectors—AI computing power, consumer electronics and AR/VR, smart vehicles and embodied robotics, and semiconductors and intelligent manufacturing—giving visitors a one-stop view of cutting-edge technologies and innovative products across the entire supply chain.

AI computing bandwidth demand explodes, CPO/NPO technologies race ahead, and new high-speed optical interconnect products make major debuts

As AI large-model training, large-scale inference and agent applications are rapidly deployed, demand for computing bandwidth is growing exponentially, and the pressure on interconnects within ultra-large-scale compute clusters is surging. This is driving continuous iteration of 800G, 1.6T and 3.2T high-speed optical module technologies, underpinning the long-term growth of the optical communications industry. At the same time, co-packaged optics centered on CPO and NPO is evolving rapidly, and optical interconnect has advanced from traditional supporting network hardware to a core foundation for breaking through the limits of AI computing power.

This year's CIOE Information and Communication Expo brings together leading optical communications companies, with multiple cutting-edge technologies and major new products making their debut and fully demonstrating the industry's innovative strength. GlobalFoundries' mature, production-proven 45SPCLO Siph platform targets specialty foundry opportunities in the Physical AI era and supports pluggable, NPO, OIO and CPO applications, enabling multiple optical engine solutions; HG Genuine has innovatively launched a 6.4T NPO optical engine that greatly reduces system power consumption through a DSP-less architecture, precisely meeting the needs of AI computing networks and ultra-large-scale data centers, helping compute clusters break through bandwidth bottlenecks and delivering high-performance, low-power high-speed optical interconnect solutions; Guanglian Xinke, a rising domestic optical interconnect unicorn, is presenting a world-first industry solution at CIOE; FiberHome has put forward the innovative concept of "Fiber for AI," creating dedicated optical connectivity solutions for AIDCs, with the engineering results of hollow-core fiber supporting multi-scenario deployment, breaking down "compute islands" and enabling cross-region high-speed interconnection of compute backbone networks; T&S Communications is a leading one-stop platform technology company in the global optical interconnect field. Leveraging a highly reusable technology platform and deep vertical integration across the supply chain, it provides one-stop optical interconnect solutions ranging from passive to active optical components; Wanliyan, together with industry partners, released an industry-leading full-scenario optical communications solution, with three new products unveiled simultaneously—a 110GHz vector network analyzer, a 1.6T portable network tester and a 90GHz optical modulation analyzer—forging a "Chinese benchmark" for the optical communications industry. The showcase by these leading players also marks high-speed optical interconnect and co-packaged optics as the hottest industry topics at this year's CIOE Information and Communication Expo. High-speed optical interconnect is not only an innovation in transmission technology, but also the "light-speed foundation" for the AI industry's continued breakthroughs. Once computing-power transmission is no longer a bottleneck, the unlimited potential of AI computing will finally be unleashed.

Optics and AI-powered sensing empower each other, driving innovation in smart terminals

Optics and AI-powered sensing are mutually reinforcing, continuously unlocking the innovation potential of end products such as automotive autonomous driving, next-generation AR consumer devices and intelligent robots. High-performance automotive lenses and camera modules upgrade intelligent vehicle perception; lightweight, high-transparency XR optical components push consumer smart wearables toward a new experience that is slim, comfortable, high-definition and true to life; high-performance optical components and modules continue to enhance mobile imaging, delivering a whole new leap in image quality and interaction for consumer products. This year's Precision Optics Expo & Camera Technology and Application Expo and AR & VR Expo fully showcase the industry vitality of optics enabling cross-sector applications and AI perception integration, unlocking new value for multi-scenario innovation in smart terminals.

Sunny Optics showcased cutting-edge technologies and products including automotive camera modules, AR optical waveguides and lens modules, vehicle-mounted lenses, and robotic vision system solutions. Fujian Forecam Optics presented a full portfolio of optoelectronic products spanning laser, infrared, aerospace, UAV, optical communications, intelligent optoelectronic monitoring, hazardous chemical gas detection and security, automotive, and AR optical products, fully serving scenarios such as commercial aerospace, the low-altitude economy, artificial intelligence, intelligent manufacturing, smart vehicles, and security surveillance. As a leading player in the XR supply chain, Goertek Optics brought to CIOE a series of new products covering AR, VR/MR, smart projection, automotive optics, and industrial vision. Yutong Optical presented a matrix of new consumer and diversified products, from all-new UAV offerings to mature solutions in security, automotive optics, and vehicle-mounted lenses, comprehensively demonstrating the latest results of its transformation into a comprehensive optical solutions platform. As a global leader in appearance structures and module solutions for smart devices, Biel Crystal made its appearance at CIOE, unveiling its innovative nanoimprint technology and all-new optical prism products, marking with the industry a technological leap from the microscopic to the monumental.

AI + Laser Manufacturing Unleashes New Momentum, Moving from Precision Manufacturing to "Extreme Intelligence"

At this year's Laser Technology and Intelligent Manufacturing Show, laser technology and AI were deeply integrated, with innovative solutions spanning the entire process chain of laser processing, precision coating, optical inspection, and micro- and nano-manufacturing. Numerous leading companies showcased their capabilities across the full industry chain, linking upstream lasers, specialty optical fibers, and core components, midstream intelligent processing equipment, and downstream application markets such as new energy, semiconductors, medical, and additive manufacturing, effectively accelerating the integration and deployment of AI technology with laser processes.

Han's Laser centered its showcase on "AI + laser" intelligent manufacturing, with two core exhibition zones and multiple major new products. Its laser equipment segment introduced new offerings including a collaborative robot handheld welder, a high-precision IC wire bonder, and a Micro LED excimer laser mass transfer system; its upstream light source segment unveiled pulsed fiber green lasers and red-blue integrated lasers, filling gaps in the domestic supply chain. Meanwhile, hollow-core fiber from its subsidiary Lingxian Technology made its public debut; the product offers ultra-low transmission loss and a high damage threshold, enabling high-power laser transmission and high-speed AI computing interconnects and helping the company position itself in the frontier of specialty fibers. HG Laser presented its focus on AI + laser intelligent manufacturing, showcasing dual-lens coupling intelligent equipment, optical prism laser chamfering intelligent equipment, and a range of samples and solutions spanning new energy, automotive, semiconductors, 3C, sheet metal, shipbuilding and bridges, medical, and consumer goods. IPG exhibited intelligent processing equipment with a real-time weld inspection system that combines AI vision inspection with closed-loop control to deliver real-time weld quality alerts and intelligent correction, precisely targeting high-growth sectors such as power batteries, energy storage, and metal 3D printing. European brand LITILIT brought a new air-cooled femtosecond laser, whose low complexity and high automation align with this year's key ultrafast laser industry trends. United Winners Laser, focused on high-precision laser welding, launched customized turnkey solutions meeting micron-level precision welding needs in semiconductor packaging and optoelectronic device manufacturing. Raycus displayed a full range of new products, including fiber lasers, semiconductor pump sources, and medical laser modules, extending its business into emerging blue-ocean fields such as semiconductor inspection, LiDAR, and minimally invasive medical applications, continually broadening the application boundaries of domestic laser technology.

Multiple New Infrared Products Launched Together; AI Empowers Infrared Thermal Imaging, Unlocking a New Paradigm of Real-Time Edge Sensing

At this year's infrared technology and applications exhibition, we saw dual-color and multispectral detectors emerging as the core hardware foundation for next-generation AI infrared sensing systems. Integrated hardware-AI turnkey solutions are being deployed rapidly, deeply embedding AI recognition, dual-band fusion, edge inference and industry-specific algorithms into complete systems. The infrared industry's commercialization model is shifting from "infrared image capture with manual back-end analysis" to infrared sensing plus on-device AI real-time alerting. The division of labor between upstream detector makers and downstream system integrators is becoming increasingly distinct. Going forward, the core competitiveness of optoelectronic system integrators will center on the combined development capability of multi-band infrared data and AI fusion algorithms.

At the show, Guide Infrared presented a comprehensive lineup of infrared core components, complete units, integrated optoelectronic systems and industry solutions. Its subsidiary Xinhuo Microelectronics unveiled the GAVIN1215MLC mid-/long-wave dual-color cooled infrared camera core for the first time. The core uses a Type-II superlattice 1280×1024/15μm dual-color focal plane detector, enabling simultaneous mid-wave and long-wave imaging on a single detector and significantly reducing system size, weight and power consumption. The complementary advantages of the two detection bands make it suitable for complex environments including rain and fog, day and night, and high and low temperatures, delivering stronger target recognition and anti-interference capability and more stable all-weather observation. It is suited to nondestructive testing, environmental monitoring, long-range surveillance, scientific research and other fields. The Night Vision Group (NVIG) premiered a cooled mid-/long-wave dual-color 640×512 focal plane detector that performs simultaneous dual-band infrared detection in the mid- and long-wave bands, suitable for anti-camouflage infrared target detection, anti-interference in artillery smoke, low-altitude target early warning and other fields. Raytron is deeply engaged in the three sensing domains of infrared, microwave and laser, as well as AI multi-dimensional perception model R&D, with full-chain core capabilities spanning application-specific integrated circuits, sensing chips, multi-dimensional sensing fusion and advanced AI models, AI-powered complete units and system solutions. It can supply MEMS chips, ASIC processor chips, full-chain infrared thermal imaging products, and laser and microwave optoelectronic system solutions worldwide. Dahua Technology (Dali Technology) presented its full range of multi-category, multi-purpose infrared thermal imaging products, debuting the multispectral intelligent image-stabilized optoelectronic system and 2048x1536 high-definition thermal imaging. Hikmicro brought more than 80 selected cutting-edge industry products, showcasing a complete thermal imaging product matrix from detectors and integrated devices to multi-scenario complete units and terminals. Several major new thermal imaging products made their debut, and the booth featured six exhibition areas—camera cores, technology, integration, industrial, pan-security and outdoor—with 11 immersive demonstrations of real-world operating conditions vividly illustrating the products' application value across industries. On the opening day, an EDA optoelectronic design and simulation tool, led by the 11th Research Institute of CETC and jointly developed by multiple domestic innovation players, was grandly released, alongside a product promotion conference and project signing ceremony.

Coupling Intelligent Sensing with AI Algorithms to Unlock New Potential in Embodied Intelligence, Autonomous Driving, and Consumer Electronics

As the key gateway linking the digital world with physical space, intelligent sensing has established automotive-grade perception, robotic 3D vision, and high-speed AI optical interconnects as the industry's three core growth drivers. This edition of the Intelligent Sensing Exhibition targets the forefront of sensing technology innovation, focusing on fast-growing tracks such as LiDAR, 3D sensing, spectral sensing, and industrial sensing. It brings together cutting-edge technologies and innovative products from across the upstream and downstream value chain, opening up a full-chain innovation pathway from optoelectronic devicesperception chipssystem solutionsto end-use deployment.

At the exhibition, several leading companies unveiled major new products and cutting-edge solutions. Lumotive presented a new-generation suite of 3D sensing and high-speed optical communication solutions for AI infrastructure, showcasing a range of debut chips spanning automotive-grade chips, consumer and industrial sensing chips, high-speed single-photon imaging, and high-speed optical interconnect technology. By integrating sensing and transmission into a unified optoelectronic link, it offers a new path to breaking through interconnect bandwidth bottlenecks in AI computing scenarios. SiTime? No. ChipSense (Xinshijie) presented 1D dToF and 3D dToF sensors, targeting the two hot sectors of automotive autonomous driving and embodied intelligence, and providing a complete perception solution from sensing hardware to upper-layer applications, helping humanoid robots and intelligent driving devices accurately perceive 3D environments. ams OSRAM, under the theme "Digital Optoelectronics, Intelligently Guiding All Things," exhibited more than 20 cutting-edge optoelectronic DEMOs. Exhibits included the disruptive EVIYOS Shape pixel-level intelligent light source, high-performance ToF sensors, OFS optical pressure sensors, the new-generation IR:6 infrared LED series, and a breakthrough imaging and display synergy technology solution for smartphones, illustrating the evolution of optoelectronic devices from lighting toward digital perception and interaction. Xintan Technology (Xintan Keji) made a major release of its latest spatial perception sensors and multiple pure solid-state LiDAR products, with applications covering autonomous driving, automotive blind-spot detection, vehicle-road collaboration, AGV/AMR unmanned forklifts, service robots, access control and security, volume measurement, and other diverse scenarios, accelerating the deployment of solid-state LiDAR in industrial and automotive markets. LiceTech (Lice Keji) exhibited its OPA pure solid-state LiDAR series and 3D multi-line LiDAR products, targeting the industry's mainstream evolution toward solid-state, miniaturized, and low-cost LiDAR, and providing high-performance hardware support for advanced intelligent driving and robotic spatial perception;

AI Empowers a New Vision of the Virtual and Real: Micro-LED and Smart Sensing Become Industry Hotspots

This year's CIOE New Display Technology Exhibition focuses on key industry hotspots such as AI optoelectronic integration, AR near-eye displays, and spatial reality interaction. It brings together companies across the new display and intelligent sensing value chain to unveil innovative products, showcase the commercialization of next-generation display and sensing technologies, and highlight the trend toward industry-chain collaboration. As AI converges deeply with optoelectronic display technology, AR near-eye display, spatial interaction, and intelligent sensing technologies are maturing rapidly. In AI visual sensing, Crystal Optech is leveraging its high-barrier GWG (arrayed waveguide grating) technology as a core engine, making deep inroads into key full-stack AR optical components and enabling leapfrog industry growth. At this year's event, Crystal Optech is globally debuting a full-color display solution that combines VHG (volume holographic grating) waveguides with Micro-LED, delivering a red-green dual-color visual breakthrough that precisely addresses diverse scenario needs and opens a new "vision" for AR displays. CHIPDISPLAY is making its CIOE debut, with 8-inch optoelectronic compound hybrid bonding and an 8-12-inch silicon wafer reconfigured production line now online, building new domestic capabilities in large-format heterogeneous integration manufacturing and accelerating mass production in AR microdisplays and digital automotive lighting. Weijiu Optoelectronics is debuting a full-stack Micro-LED solution covering every step from epitaxy to full-color display, suited to near-eye displays and in-vehicle interaction, helping drive hardware toward smaller size and higher resolution. Westlake Yanshan is unveiling its self-developed 10,000-PPI-class Micro-LED microdisplay light engine, "Weimang," alongside a full suite of core AR/XR solutions including light engines, waveguide modules, and high-brightness near-eye display optical systems, addressing the pain points of high resolution and light weight in devices and enabling mass production of consumer AR glasses. Spatial reality display is a major highlight of the show. Jupiter SR is presenting a spatial reality product portfolio spanning large-screen terminals to consumer desktop products, adapted to diverse application scenarios. The brand's digital human, Sami, is also appearing in on-site real-world interaction, intuitively demonstrating a new spatial interaction experience that blends the virtual and the real and showcasing a new interaction paradigm.

Uniting Industry, Academia and Research to Power New Engines of Optoelectronics Commercialization

As a core hub for industry-academia-research-user collaboration, this year's show focuses on the market-driven commercialization of research results, bringing together leading domestic research institutions under a "frontier technology + application-oriented" showcase model that highlights China's formidable research strength in optoelectronics. Exhibitors span research institutes, universities and other entities, including Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences; Xi'an Institute of Optics and Precision Mechanics, CAS; Shanghai Institute of Optics and Fine Mechanics, CAS; Institute of Optics and Electronics, CAS; Peking University Yangtze Delta Institute of Optoelectronics; Institute of Precision Optical Engineering, Tongji University; Westlake Institute of Optoelectronics; Changchun University of Science and Technology; and Xi'an Technological University, presenting breakthroughs in fundamental optoelectronics research and key technologies. This concentrated showcase of frontier technologies and research results not only builds an efficient bridge between the "lab" and the "market," but also injects strong momentum into high-quality development of the optoelectronics industry through deep industry-academia-research collaboration.

More Than 90 Professional Forums Held Concurrently, Global Insights Chart a New Blueprint for the Industry

More than an exhibition, the concurrent China International Optoelectronics Summit brings together a multi-level international exchange platform integrating industry, academia, research and users, with more than 90 industrial, application, academic and international conferences gathering global industry leaders to discuss development trends. OGC, Asia's premier optoelectronics academic conference, supports industry development. The 2026 Global Optoelectronics and Semiconductor Development Summit focuses on the optoelectronics and semiconductor industries, exploring technology roadmaps, market opportunities and cross-regional cooperation strategies. International conferences, held jointly with Yole Group, the European Photonics Industry Consortium, ePIXfab European Silicon Photonics Alliance and other authoritative organizations, address topics including optoelectronic technologies in the AI wave, innovation in the optical industry chain and silicon photonics; industrial conferences cover AI-era optical transmission technology, optical interconnect technology, computational optical imaging, meta- and micro/nano-optics, advanced laser micro/nano processing manufacturing, laser medicine, infrared detection technology and a quantum technology forum. A "Light + Application Forum" is also held, inviting downstream application companies and optoelectronics firms to engage in in-depth dialogue on hot topics such as smart vehicles, AR glasses, new displays, embodied robots and smart homes, promoting precise alignment between technology and application scenarios.

From September 9 to 11 at the Shenzhen World Exhibition and Convention Center, CIOE China International Optoelectronic Expo warmly invites optoelectronics companies and upstream and downstream partners from around the world to gather, conduct efficient business negotiations, precisely match cooperation resources, stay abreast of industry frontier developments in real time and gain deep insight into market trends, helping companies seize new opportunities in optoelectronics!