A team from the Department of High-Power Laser Component Technology and Engineering at the Shanghai Institute of Optics and Fine Mechanics (SIOM) used nanoimprint lithography to fabricate large-area, double-sided fused-silica nanopillar metasurfaces, achieving broadband, wide-angle antireflection from the visible to near-infrared, along with good high-temperature stability and laser damage tolerance.
Why we recommend it: The original article provides a scalable nanoimprint process and laser damage tolerance, offering practical value for high-power laser optics
Xinguang Optoelectronics announced on September 22 plans to invest RMB 100 million to establish a wholly owned subsidiary, Hangzhou Xinguang Precision Measurement Systems Co., Ltd., in Hangzhou, with an initial paid-in capital of RMB 10 million. Its main business will cover optical test systems including optical instruments, measurement and inspection equipment, optoelectronic sensors and projection objectives.
A team led by researcher Wei Chaoyang at the Shanghai Institute of Optics and Fine Mechanics has systematically revealed the microscopic mechanism behind performance degradation of ion-beam-finished fused silica under gamma-ray irradiation induced by hydration, providing a basis for stable service of fused silica components in radiation-rich environments such as space.
A team led by researcher Wei Chaoyang at the Shanghai Institute of Optics and Fine Mechanics has published a review systematically covering the full technology chain of CO2 laser processing of fused silica optical components, from fundamental physical mechanisms to advanced functional applications.
C114 Insight notes that at CIOE 2026, optical module makers are competing on 1.6T, 3.2T and 6.4T speeds, while test and measurement is another crowded arena. Lianxun Instruments, which listed on the STAR Market this April, saw its shares reach a high of 2777.77 yuan within three months of its debut, making it the most expensive stock on the A-share market. The company supplies test equipment for optical modules and CPO optical engines.
A team led by Academician Zhang Xuejun and Researcher Li Longxiang at the Changchun Institute of Optics, Fine Mechanics and Physics (CIOMP) has published the review Optical manufacturing and testing of large-aperture optical mirrors: a review in Light: Advanced Manufacturing, systematically surveying processing and testing technologies for large-aperture optical components using major international telescope projects as case studies.
The Shanghai Institute of Optics and Fine Mechanics and Harbin Institute of Technology have used a photon sieve to achieve the first absolute wavefront measurement of an EUV light source, solving the challenge of absolute wavefront measurement for extreme-ultraviolet and soft X-ray sources.
Xishi Technology, an incubatee of the Hangzhou Institute of Optics and Mechanics, has delivered high-precision optical film thickness measurement equipment to a global semiconductor and optical communications leader and deployed it on production lines.
A team led by Academician Zhang Xuejun at the Changchun Institute of Optics, Fine Mechanics and Physics published a paper in Laser & Photonics Reviews, proposing direct writing of amorphous silicon thin films with femtosecond lasers below the ablation threshold, using residual stress from solid-phase transformation to form controllable nanoscale surface topography.
A team led by Researcher Fang Yonghua at the Hefei Institutes of Physical Science has developed a dual-differential sphere-tube coupled photoacoustic-scattering system that simultaneously obtains aerosol absorption and scattering coefficients at 450 nm and 532 nm within a single sampling path and shared measurement volume. The results were published in Photoacoustics. Two laser beams are modulated at 2572 Hz and 169 Hz and demodulated by frequency using an FPGA-based digital lock-in amplifier. With a 1 s integration time, detection limits for the 532 nm absorption and scattering channels are 1.2 Mm⁻¹ and 1.32 Mm⁻¹, respectively.
The Hangzhou Institute of Optics and Mechanics attended the third Changchun International Optics Expo, held June 12 to 14, together with incubated companies including the Russell Advanced Optical Wave Science Center and Xishi Technology. The Russell Center said its proprietary 'new structure' low-loss hollow-core fiber achieved continuous drawing lengths greater than 15 km, with a minimum loss of about 0.1 dB/km in the telecom band. Xishi Technology showcased optical film thickness measurement and thin-film inspection equipment.
The Optoelectronics Center of the Anhui Institute of Optics and Fine Mechanics published a paper in Analytical Chemistry describing CrisprDEM, a digital hydrogel fluorescence-enhanced microsphere detection system based on CRISPR/Cas12a that enables amplification-free relative quantification of nucleic acids. The system uses hydrogel microspheres to enrich fluorescent reporter molecules, boosting the fluorescence signal by a factor of about 1,000. A microfluidic chip then spreads the microspheres into a monolayer for imaging, and a K-means algorithm distinguishes positive from negative microspheres, with the proportion of positive microspheres used for quantification.
A team led by Researcher Zhang Ge at the Changchun Institute of Optics, Fine Mechanics and Physics and Wang Gong's team at the Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, published a paper in Light: Advanced Manufacturing proposing a binder jetting additive manufacturing method for graphite/silicon carbide composite powder that improves particle flowability and promotes the conversion of free silicon into secondary silicon carbide.
The Russell Center at the Hangzhou Institute of Optics and Mechanics, together with the Shanghai Institute of Optics and Fine Mechanics, published a paper in High Power Laser Science and Engineering, demonstrating high-quality transmission and precision machining of high-power picosecond lasers using a single-ring anti-resonant hollow-core fiber.
Jingfei Semiconductor, a platform-invested company of the Hangzhou Institute for Optics and Photonics, has been included in the "Beijing 2025 Second Group of High-Tech Enterprises" list. Jingfei Semiconductor is a manufacturer of precision semiconductor laser processing equipment and has achieved mass production of 8/12-inch silicon carbide laser lift-off equipment.
Jingfei Semiconductor has achieved lift-off of 12-inch silicon carbide wafers using its self-developed laser lift-off equipment. The technology has previously been validated by multiple customers in the 6-inch and 8-inch silicon carbide segments. Compared with mainstream 6-inch wafers, 12-inch wafers offer about four times the usable area and reduce per-chip costs by 30% to 40%. This breakthrough breaks the technological monopoly held by overseas manufacturers in large-size silicon carbide processing equipment and provides equipment support for expanding silicon carbide capacity.
The investment platform of the Hangzhou Institute of Optics and Fine Mechanics has completed an angel-round investment in Xishi Technology. The funds will be used to expand production capacity for high-precision film thickness measurement instruments, upgrade next-generation optical algorithms, and develop the market. Xishi Technology's film thickness gauge product line covers benchtop, vacuum, handheld, line-scan, and OEM modules, with a measurement range from 1 nm to 1 mm and support for both single-layer and multilayer film measurement. Its optical structure and optomechanical system are 100% domestically sourced, and its light source utilization rate is five times that of comparable imported equipment.