Guangyin Technology Unveils 8x8 Nanosecond-Class OCS
Guangyin Technology has released an 8x8 nanosecond-class optical circuit switch, moving optical switching closer to the compute side.
Technical and industry progress in silicon photonic chips and co-packaged optics (CPO) for AI data centers.
Guangyin Technology has released an 8x8 nanosecond-class optical circuit switch, moving optical switching closer to the compute side.
Innolight said NPO could see its first shipments in 2027, and the share of overseas production capacity will increase.
Cignal AI has raised its forecast for the optical circuit switch market, projecting that it could exceed $8 billion by 2030.
Nokia is stepping up its optical interconnect business amid the AI supercycle.
Duogen Hexin has begun large-scale volume production of CWDM4 100mW high-power CW DFB chips and COC devices for 400G/800G/1.6T data centers.
LightCounting analyzes the three major hurdles facing large-scale CPO/NPO deployment.
LightCounting forecasts that the Ethernet optical module market will grow 73% in 2026.
JONHON has introduced the ELSFP external light source optical connector designed for CPO/NPO architectures, consisting of host-side and module-side connectors.
China Unicom's Hu Yakun discusses optical interconnect technologies and practical applications for intelligent computing centers.
Alibaba Cloud's Wang Peng outlines the evolution of OCS technology for AI clusters and its application outlook.
Teams led by Wang Binhao and Zhang Wenfu at the Xi'an Institute of Optics and Precision Mechanics have made a series of advances in silicon-based photonic interconnect chips.
Why we recommend it: The original article provides specific data and details that help assess the actual progress in this direction.
Silicon photonics chip and optical module solutions from Intel, HG Genuine, Accelink Technologies and other vendors target high-speed interconnect needs in AI and data centers. Intel's OCI chipset supports 64 data channels of 32 Gbps in each direction, reaches up to 100 m and consumes 5 pJ per bit. HG Genuine, Accelink Technologies and others showcased 1.6T modules. The survey also covers 800G silicon photonics engines and modules, linear pluggable optics and co-packaged optics (CPO) light source modules.