Skip to content

Silicon Photonics and CPO

Technical and industry progress in silicon photonic chips and co-packaged optics (CPO) for AI data centers.

32 items UpdatesRelated topicsOptical ModulesOptical Communications & Fiber

Latest updates

Items 21–32 of 32
Sep 9Wed
Aug 25Tue
Aug 18Tue
Aug 17Mon
Aug 10Mon
Aug 4Tue
Jul 24Fri
Jul 23Thu
May 25Mon
  1. Xi'an Institute of Optics and Fine Mechanics (XIOPM) · Research ProgressOptics industryOptics and AI63

    Xi'an Institute of Optics and Precision Mechanics Reports Series of Advances in Silicon Photonic Interconnect Chips

    Teams led by Wang Binhao and Zhang Wenfu at the Xi'an Institute of Optics and Precision Mechanics have made a series of advances in silicon-based photonic interconnect chips.

    Why we recommend it: The original article provides specific data and details that help assess the actual progress in this direction.

Oct 17Thu
  1. Guangdian Hui · TrendsOptics industryOptics and AI57

    Surveying Current Advanced Silicon Photonics Solutions

    Silicon photonics chip and optical module solutions from Intel, HG Genuine, Accelink Technologies and other vendors target high-speed interconnect needs in AI and data centers. Intel's OCI chipset supports 64 data channels of 32 Gbps in each direction, reaches up to 100 m and consumes 5 pJ per bit. HG Genuine, Accelink Technologies and others showcased 1.6T modules. The survey also covers 800G silicon photonics engines and modules, linear pluggable optics and co-packaged optics (CPO) light source modules.