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Oct 16Fri
  1. OFweek Optics Network · NewsOptics industryOptics and AI61

    Fanchuangwei High-Transparency Optical AR Lens Project Lands in Taizhou with Total Investment of About RMB 550 Million

    Shanghai Fanchuangwei Technology's high-transparency optical AR glasses lens project has settled in Huangyan, Taizhou, to be carried out in two phases by Fanke Technology (Taizhou), with total investment of about RMB 550 million. Phase one, at about RMB 150 million, plans to complete an innovation center and pilot production line by 2027. Phase two, at about RMB 400 million, targets annual output of 100 tonnes of high-purity silicon carbide optical material by 2028. Aimed at AI glasses and AR terminals, the project covers the full chain from optical materials and etching processes to optical devices.

    Why we recommend it: The source gives the investment figures for both phases, production line timelines and a target of 100 tonnes of silicon carbide optical material per year, useful for gauging the pace of silicon carbide waveguide industrialization.

Oct 15Thu
  1. C114 Communications Network · Optical CommunicationsOptics industryOptics and AI67

    Silicon Photonics Chipmaker Xihe Technology Files Registration Version of STAR Market Prospectus

    Shanghai Xihe Technology has released the registration version of its STAR Market IPO prospectus, describing itself as one of the world's major suppliers of silicon photonic integrated chips. Its customers include leading optical module makers and cloud service providers, and its products are already shipping at scale into AI clusters and hyperscale data centers. According to estimates by optical module makers, at the same speed and distance, silicon photonic solutions can reduce total cost by nearly 20% and cut the volume of components within a module by nearly 30%.

    Why we recommend it: The source provides cost and volume data for silicon photonics versus discrete components, helping to understand the domestic supply chain for AI data center optical interconnects.

Oct 14Wed
  1. Photonics.comOptics industryOptics and AI61

    Salience Labs Raises USD 125 Million Series B to Develop Photonic Switching Chips for AI Data Centers

    Salience Labs, which develops photonic chips for AI data center interconnects, has closed an oversubscribed USD 125 million Series B round. The company previously demonstrated a 64-port all-optical silicon photonic circuit switch at ECOC 2026.

    Why we recommend it: The source article links the funding to the 64-port all-optical switch demonstration at ECOC, helping assess the commercial progress of silicon photonic optical switching

  2. optics.org (SPIE Industry News)Optics industryOptics and AI61

    UK Silicon Photonics Firm Salience Labs Raises USD 125 Million Series B

    UK-based silicon photonics company Salience Labs has closed a USD 125 million Series B round to expand development of optical circuit switch (OCS) technology and ease network bottlenecks in AI data centers.

    Why we recommend it: The source article highlights the positioning of optical circuit switching against AI data center bottlenecks, helping understand capital enthusiasm for silicon photonic switching

Oct 9Fri
  1. Electro OpticsOptics industryOptics and AI69

    JEDEC Releases First Silicon Photonics AI Network Reliability Standard, JESD264

    JEDEC has released the JESD264 standard, setting new certification and reliability requirements for the emerging silicon photonics market. It is the first reliability standard for silicon photonics in AI networks.

    Why we recommend it: The article explains that silicon photonic devices now have a dedicated reliability certification standard for the first time, helping understand the threshold for silicon photonics entering large-scale AI network deployment

Sep 29Tue
Sep 25Fri
  1. C114 Communications Network · Optical CommunicationsOptics industryOptics and AI56

    Photon Bridge CCO: Tackling Mass-Production Bottlenecks for External Light Sources in AI Optical Interconnects

    In an exclusive interview with C114, Photon Bridge's Chief Commercial Officer discusses the interconnect bandwidth pressure created by expanding AI compute clusters and the role of integrated photonics in breaking through optical module power and density limits, with a focus on the mass-production challenges of external light sources (ELS) and the Dutch integrated photonics ecosystem.

Sep 23Wed
  1. OFweek Optics Network · NewsOptics industryOptics and AI61

    Largan Precision Buys Land Seven Times in Three Months, Spending CNY 8 Billion on CPO Fiber Arrays

    On September 17, Largan Precision spent CNY 1.172 billion to acquire about 2,259 ping of land and 3,695 ping of buildings in Nantun, Taichung. This was its seventh real estate transaction since late June, bringing the total to CNY 8.078 billion. Chairman Lin Enping confirmed in July that the company had received its first fiber array order from a customer, with the land purchases paving the way for mass production in 2027.

    Why we recommend it: The original article gives the pace and value of the land purchases, showing the scale of the smartphone lens leader's bet on CPO fiber arrays

Sep 20Sun
  1. C114 Communications Network · Optical CommunicationsOptics industryOptics and AI56

    CIOE's Hidden Star: Optical Interconnect Testing Gets Repriced

    C114 Insight notes that at CIOE 2026, optical module makers are competing on 1.6T, 3.2T and 6.4T speeds, while test and measurement is another crowded arena. Lianxun Instruments, which listed on the STAR Market this April, saw its shares reach a high of 2777.77 yuan within three months of its debut, making it the most expensive stock on the A-share market. The company supplies test equipment for optical modules and CPO optical engines.

  2. C114 Communications Network · Optical CommunicationsOptics industryOptics and AI61

    CIOE 2026 Observations: Why NPO Is the Optimal Choice for Cloud Giants

    The 27th CIOE drew nearly 190,000 visits over three days, up 32% year on year. NPO (near-package optics) products from major domestic optical module makers made a concentrated appearance. NPO moves the optical engine from the switch front panel to near the ASIC package without soldering it to the switch chip, balancing power consumption and serviceability.

    Why we recommend it: The source text explains the trade-offs of NPO versus CPO and pluggables, helping to understand cloud vendors' selection logic

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May 25Mon
  1. Xi'an Institute of Optics and Fine Mechanics (XIOPM) · Research ProgressOptics industryOptics and AI63

    Xi'an Institute of Optics and Precision Mechanics Reports Series of Advances in Silicon Photonic Interconnect Chips

    Teams led by Wang Binhao and Zhang Wenfu at the Xi'an Institute of Optics and Precision Mechanics have made a series of advances in silicon-based photonic interconnect chips.

    Why we recommend it: The original article provides specific data and details that help assess the actual progress in this direction.

Oct 17Thu
  1. Guangdian Hui · TrendsOptics industryOptics and AI57

    Surveying Current Advanced Silicon Photonics Solutions

    Silicon photonics chip and optical module solutions from Intel, HG Genuine, Accelink Technologies and other vendors target high-speed interconnect needs in AI and data centers. Intel's OCI chipset supports 64 data channels of 32 Gbps in each direction, reaches up to 100 m and consumes 5 pJ per bit. HG Genuine, Accelink Technologies and others showcased 1.6T modules. The survey also covers 800G silicon photonics engines and modules, linear pluggable optics and co-packaged optics (CPO) light source modules.